Substrate Packaging Defect Metro Tool Owner

intel· 100 Intel Corporation
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📍 US, Arizona, PhoenixFull time💰 USD 104K–199K

About this role

Job Details:

Job Description: 

We are seeking a motivated and skilled engineer to join our SPTD Yield team as a Defect Metrology Engineer. In this role, you will help drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate as well as assembly test mfg (ATM) factories for Intel's IPG and IFS customers. Our goal is to be the supplier of choice for advanced, cost-effective substrate packaging by developing leading-edge systems, process capabilities, and inspection technologies to achieve top yields. Join us on our mission to make Intel a great workplace and industry leader.

Responsibilities included but not limited to the following:

  • Use defect inspection tools to detect and resolve process issues, collaborating with defect reduction, process integration, and module teams to improve yield. Apply real-time data analysis, reporting, and DOE summaries to guide improvements and decision-making.

  • Maintain flexibility and adaptability to support the evolving demands in Yield space, responding to new challenges and requirements as they arise.

  • Direct next-generation tool installation, reaching major milestones-purchase-spec development, source inspection, design, pre-fac, Safety level approval, Supplier qual, Intel qual, etc.-by collaborating with diverse stakeholders.

  • Demonstrate the ability to manage work independently, proactively identifying and resolving issues with minimal supervision, and providing leadership in defect metrology and Yield enhancement initiatives.

  • Work with factory teams and module partners to maintain WIP velocity targets in your area. Develop and roll out procedures and equipment setups for defect metrology tools to ensure they meet quality goals. Set up data flows for new tools by connecting them to automation and yield analysis systems, guaranteeing smooth performance and reliable data.

  • Create and outline equipment roadmaps that support capabilities matching program requirements for new substrate technologies. Collaborate with equipment suppliers and Supply chain partners to maintain current toolsets and enhance features, such as software and hardware upgrades, to satisfy Substrate packaging program objectives.

  • Present critical tool and system capabilities developed to meet program deliverables to APTM leadership, showcasing both defect metrology and micro-contamination expertise, and demonstrating a strong capacity for independent leadership, adaptability, and proactive problem-solving in a fast-paced, evolving environment.

  • Performs descriptive statistical analysis, develops visualizations, applications, dashboards, or presentations and communicates insights in a clear and effective way to help the organization with better decision-making.

  • Organizes, interprets and structures insights from data, detects data anomalies and makes corrections.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.  Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. 

Minimum Qualifications:

  • Must possess a bachelor's degree in electrical engineering, Chemical Engineering, Optical Engineering, Materials Science, Physics or related field of study and 3 years of semi-conductor experience, OR

  • Master's degree in electrical engineering, Chemical Engineering, Optical Engineering, Materials Science, Physics or related field of study and 2 years of Semi-Conductor experience, OR

  • PhD Degree in Electrical Engineering, Chemical Engineering, Optical Engineering, Materials Science, Physics or related field of study and 1+ years of Semi-Conductor experience

  • Previous experience in micro-contamination management within a semiconductor manufacturing setting

  • Experience as a Yield Analyst OR Defect reduction owner Or with Defect metrology tool ownership

  • Strong programming skills in Python.

Preferred Qualifications:

  • Knowledge of statistics and experimental design and the skills to apply that knowledge tool qualification, and process development.

  • Demonstrated understanding of semiconductor process flows and/or defect metrology assessment based on process requirements.

  • Requirements listed would be obtained through a combination of industry-related job experience, internship experience, and schoolwork/classes/research.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $103,730.00-198,820.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Frequently Asked Questions

What is the salary for the Substrate Packaging Defect Metro Tool Owner role at intel?
The listed salary for this Substrate Packaging Defect Metro Tool Owner position at intel is USD 104K–199K. This is an Full time role.
Where is the Substrate Packaging Defect Metro Tool Owner position at intel located?
This Substrate Packaging Defect Metro Tool Owner role at intel is based in US, Arizona, Phoenix. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Substrate Packaging Defect Metro Tool Owner role at intel full-time or part-time?
This is listed as a Full time position. It is posted as a Substrate Packaging Defect Metro Tool Owner role in the 100 Intel Corporation department at intel.
Which team or department does the Substrate Packaging Defect Metro Tool Owner at intel belong to?
This Substrate Packaging Defect Metro Tool Owner position is part of the 100 Intel Corporation department at intel. See the full job description for more information about the team structure and responsibilities.
How do I apply for the Substrate Packaging Defect Metro Tool Owner position at intel?
Click the "Apply Now" button on this page. You will be redirected to intel's official application portal hosted on workday where you can submit your application directly.
When was the Substrate Packaging Defect Metro Tool Owner job at intel posted?
This Substrate Packaging Defect Metro Tool Owner position at intel was posted on Aug 20, 2026. Apply as soon as possible — early applications are often reviewed first.
Substrate Packaging Defect Metro Tool Owner
intel · 💰 USD 104K–199K
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