Advanced Packaging Process Integration Engineer

intelยท 750 Intel Technology Sdn. Bhd
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๐Ÿ“ Malaysia, Kulim๐Ÿ“ Malaysia, PenangFull time

About this role

Job Details:

Job Description:ย 

The Role and Impact As a Process Integration and Yield Engineer, you will play a pivotal role in driving process optimization and innovation to ensure high-yield performance in advanced packaging technologies. You will oversee day-to-day integration of processes across various toolsets, analyze data to identify trends, and implement solutions to enhance yields and minimize defects. Your work will directly impact Intel's ability to deliver leading-edge semiconductor products efficiently and with exceptional quality. Business group Intel Corporation is at the forefront of innovation, delivering world-class semiconductor technologies that power countless devices worldwide. This role is part of NM Advanced Packaging, which focuses on developing cutting-edge packaging solutions to meet the ever-evolving demands of modern computing. The team contributes to Intel's mission of enabling transformative computing experiences by ensuring robust designs, optimized processes, and scalable manufacturing solutions. Key Responsibilities - Collaborate with cross-functional teams to develop and refine process integration strategies for advanced packaging technologies. - Monitor and analyze yield performance, identifying root causes of variability and implementing corrective actions to improve production outcomes. - Develop and maintain process control systems to ensure consistency and reliability across manufacturing operations. - Design experiments and analyze data from test runs to drive process enhancements and address technical challenges. - Contribute to continuous improvement efforts by identifying opportunities to optimize workflows and reduce cycle times. - Support new technology introduction and ramp-up by integrating novel processes into production environments.

Qualifications:

Minimum Qualifications - Bachelor's degree in a relevant field such as Materials Science, Chemical Engineering, or Electrical Engineering, with 4+ years of hands-on experience in process integration within semiconductor manufacturing OR Master's degree in a relevant field with 3+ years of domain-related experience OR PhD in a relevant field with no prior professional experience. - Demonstrated expertise in statistical process control methodologies and yield analysis. - Proficiency in data analysis using tools such as Python, MATLAB, or statistical software. - Experience with advanced packaging technologies or semiconductor manufacturing processes. - Knowledge of experimental design and failure analysis techniques. Preferred Qualifications - Strong communication skills and ability to collaborate effectively across diverse teams and functions. - Proven track record of solving complex technical challenges and driving innovative solutions. - Familiarity with project management principles and ability to prioritize tasks in fast-paced environments. - Passion for learning and staying updated on industry trends and advancements in semiconductor packaging technologies. Take the next step in your career by joining Intel, where you can make a tangible impact on cutting-edge technologies and contribute to shaping the future of computing.

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Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location:ย 

Malaysia, Penang

Additional Locations:

Malaysia, Kulim

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Frequently Asked Questions

Is the salary disclosed for the Advanced Packaging Process Integration Engineer position at intel?
The salary for this Advanced Packaging Process Integration Engineer role at intel is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the Advanced Packaging Process Integration Engineer position at intel located?
This Advanced Packaging Process Integration Engineer role at intel is based in Malaysia, Kulim, Malaysia, Penang. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Advanced Packaging Process Integration Engineer role at intel full-time or part-time?
This is listed as a Full time position. It is posted as a Advanced Packaging Process Integration Engineer role in the 750 Intel Technology Sdn. Bhd department at intel.
Which team or department does the Advanced Packaging Process Integration Engineer at intel belong to?
This Advanced Packaging Process Integration Engineer position is part of the 750 Intel Technology Sdn. Bhd department at intel. See the full job description for more information about the team structure and responsibilities.
How do I apply for the Advanced Packaging Process Integration Engineer position at intel?
Click the "Apply Now" button on this page. You will be redirected to intel's official application portal hosted on workday where you can submit your application directly.
When was the Advanced Packaging Process Integration Engineer job at intel posted?
This Advanced Packaging Process Integration Engineer position at intel was posted on Oct 2, 2026. Apply as soon as possible โ€” early applications are often reviewed first.
Advanced Packaging Process Integration Engineer
intel
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