Package Development Engineer

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📍 Zhubei, Hsinchu County, TaiwanFull time

About this role

Lead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, reliable, and cost-effective products.

  • Lead package development activities from concept, design, qualification, and production release.
  • Develop and optimize substrate-based and leadframe-based flip-chip package technologies.
  • Drive package architecture, material selection, assembly process development, and manufacturability improvements.
  • Support flip-chip integration, including bumping, underfill, reflow, molding, and singulation process optimization.
  • Develop qualification plans and assess package reliability performance.
  • Lead root-cause investigations and corrective actions for package, assembly, and reliability issues.
  • Collaborate with OSATs and suppliers on process development, yield improvement, and cost reduction initiatives.
  • Support NPI execution and transfer technologies into high-volume manufacturing.
  • BS/MS in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
  • 8+ years of semiconductor package development experience.
  • Strong expertise in: 
    • Flip-chip packaging technologies
    • FC-BGA and FC-LGA packages
    • FC-QFN, FC-DFN, DrMOS, and SPS packages
    • Leadframe and substrate packaging processes
    • Package reliability and qualification
  • Knowledge of DOE, DFMEA, SPC, 8D, and statistical problem-solving methodologies.
  • Experience working with OSATs, substrate suppliers, and material vendors.
  • Strong technical leadership and project management skills.
  • Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
  • Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
  • Proven ability to lead projects across organizations and cultures in a fast-paced environment.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

Frequently Asked Questions

Is the salary disclosed for the Package Development Engineer position at onsemi?
The salary for this Package Development Engineer role at onsemi is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the Package Development Engineer position at onsemi located?
This Package Development Engineer role at onsemi is based in Zhubei, Hsinchu County, Taiwan. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Package Development Engineer role at onsemi full-time or part-time?
This is listed as a Full time position. It is posted as a Package Development Engineer role at onsemi.
How do I apply for the Package Development Engineer position at onsemi?
Click the "Apply Now" button on this page. You will be redirected to onsemi's official application portal hosted on oraclecloud where you can submit your application directly.
When was the Package Development Engineer job at onsemi posted?
This Package Development Engineer position at onsemi was posted on Sep 8, 2026. Apply as soon as possible — early applications are often reviewed first.
Package Development Engineer
onsemi
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