Package Development Engineer
About this role
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package architecture, material selection, process development, reliability qualification, and manufacturing readiness while collaborating with internal and external partners throughout the product development lifecycle.
- Develop embedded package architectures with embedded passives, active devices, and HDI substrates.
- Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules.
- Lead process development for embedding, lamination, laser drilling, metallization, and assembly.
- Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements.
- Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions.
- Conduct root cause analysis and implement yield, quality, and cost improvements.
- Lead cross-functional teams through concept, development, qualification, and production release.
- BS/MS in Electrical, Mechanical, Materials, Chemical Engineering, or related field.
- 8+ years of semiconductor package development experience.
- Proven expertise in embedded packaging, substrate technologies, and advanced interconnects.
- Strong knowledge of package reliability, failure analysis, and manufacturing processes.
- Experience with DOE, statistical analysis, and process optimization.
- Experience working with OSATs, substrate suppliers, and material vendors.
- Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
- Proven ability to lead projects across organizations and cultures in a fast-paced environment.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
Frequently Asked Questions
Is the salary disclosed for the Package Development Engineer position at onsemi?
The salary for this Package Development Engineer role at onsemi is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the Package Development Engineer position at onsemi located?
This Package Development Engineer role at onsemi is based in Munich, Bayern, Germany, Scottsdale, AZ, United States. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Package Development Engineer role at onsemi full-time or part-time?
This is listed as a Full time position. It is posted as a Package Development Engineer role at onsemi.
How do I apply for the Package Development Engineer position at onsemi?
Click the "Apply Now" button on this page. You will be redirected to onsemi's official application portal hosted on oraclecloud where you can submit your application directly.
When was the Package Development Engineer job at onsemi posted?
This Package Development Engineer position at onsemi was posted on Sep 15, 2026. Apply as soon as possible — early applications are often reviewed first.
Package Development Engineer
onsemi
You'll be redirected to onsemi's official application page on oraclecloud.