C2C Bonding Engineer

sec· Samsung Austin Semiconductor, LLC.
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📍 12100 Samsung Blvd, Austin, TX, USAFull time💰 USD 131K–206K
Full timeOn-siteSamsung Austin Semiconductor, LLC.

About this role

About Samsung Austin Semiconductor
Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow. 

Come innovate with us!

Position Summary

In your role as a Copper-to-Copper (C2C) Bonding Expert, you'll be responsible to lead the development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CMOS Image Sensors (CIS).

You'll use your expertise to drive innovations in hybrid bonding processes enabling stacked image sensors with superior yield, performance and reliability.

Role and Responsibilities

Here's what you'll be responsible for:

  • Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.
  • Own all Systematic Yield/Reliability related issues for these steps.
  • Lead projects to cure these systematics from the technology and/or improve detection for them.
  • Own critical dimension targeting and variation control within the Module.
  • Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
  • Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.

Skills and Qualifications

Here's what you'll need:

  • Bachelor’s Degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field
  • 5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience is required. 10+ years of experience in Process/Module Integration highly preferred.
  • Expert understanding of overall process flow in assigned areas - Demonstrated understanding of the interactions between process and yield, product performance and reliability.
  • Prior knowledge in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) highly preferred.

The current base salary range for this role is between $131,000 - $206,000. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.

Total Rewards
At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.

We offer a comprehensive benefits package, including:

  • Medical, dental, and vision insurance

  • Life insurance and 401(k) matching with immediate vesting

  • Onsite café(s) and workout facilities

  • Paid maternity and paternity leave

  • Paid time off (PTO) + 2 personal holidays and 10 regular holidays

  • Wellness incentives and MORE
     

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at Samsung Austin Semiconductor are full-time on-site.

U.S. Export Control Compliance
This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.

Trade Secrets Notice
 By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.

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* Samsung Electronics America, Inc. and its subsidiaries are committed to Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, status as a qualified individual with a disability, or any other characteristic protected by law.

Frequently Asked Questions

What is the salary for the C2C Bonding Engineer role at sec?
The listed salary for this C2C Bonding Engineer position at sec is USD 131K–206K. This is an Full time role.
Where is the C2C Bonding Engineer position at sec located?
This C2C Bonding Engineer role at sec is based in 12100 Samsung Blvd, Austin, TX, USA. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the C2C Bonding Engineer role at sec full-time or part-time?
This is listed as a Full time position. It is posted as a C2C Bonding Engineer role in the Samsung Austin Semiconductor, LLC. department at sec.
Which team or department does the C2C Bonding Engineer at sec belong to?
This C2C Bonding Engineer position is part of the Samsung Austin Semiconductor, LLC. department at sec. See the full job description for more information about the team structure and responsibilities.
How do I apply for the C2C Bonding Engineer position at sec?
Click the "Apply Now" button on this page. You will be redirected to sec's official application portal hosted on workday where you can submit your application directly.
When was the C2C Bonding Engineer job at sec posted?
This C2C Bonding Engineer position at sec was posted on Aug 12, 2026. Apply as soon as possible — early applications are often reviewed first.
C2C Bonding Engineer
sec · 💰 USD 131K–206K
Apply for this role ↗

You'll be redirected to sec's official application page on Workday.