About this role

Job Details:

Job Description: 

Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record.

Required Skills and Experience:

  • Self-motivated engineer who has strong technical background in design and electrical analysis.
  • Solid background in semiconductor fabrication and packaging
  • Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions. - Ability to work independently and at various levels of abstraction
  • Strong organization, time management, and communication skills, self-motivated.
  • Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
  • Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
  • Experience and knowledge with assembly process, test and characterization techniques preferred

Qualifications:

  • Ph.D./master’s in electrical engineering/ chemical engineering/ mechanical engineering or Material Science.
  • 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple Cities

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.The application window for this job posting is expected to end by 06/09/2026

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Frequently Asked Questions

What is the salary for the ADCE Packaging Design Architect role at intel?
The listed salary for this ADCE Packaging Design Architect position at intel is USD 221K–312K. This is an Full time role.
Where is the ADCE Packaging Design Architect position at intel located?
This ADCE Packaging Design Architect role at intel is based in US, Arizona, Phoenix, US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple Cities. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the ADCE Packaging Design Architect role at intel full-time or part-time?
This is listed as a Full time position. It is posted as a ADCE Packaging Design Architect role in the 100 Intel Corporation department at intel.
Which team or department does the ADCE Packaging Design Architect at intel belong to?
This ADCE Packaging Design Architect position is part of the 100 Intel Corporation department at intel. See the full job description for more information about the team structure and responsibilities.
How do I apply for the ADCE Packaging Design Architect position at intel?
Click the "Apply Now" button on this page. You will be redirected to intel's official application portal hosted on workday where you can submit your application directly.
When was the ADCE Packaging Design Architect job at intel posted?
This ADCE Packaging Design Architect position at intel was posted on Sep 11, 2026. Apply as soon as possible — early applications are often reviewed first.
ADCE Packaging Design Architect
intel · 💰 USD 221K–312K
Apply for this role ↗

You'll be redirected to intel's official application page on Workday.