SiC Wafer & Package Technology Development Engineer
About this role
Technical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device.
- Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals.
- Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams.
- Understand detailed customer requirements and verify latest technologies meet or exceed all expectations.
- Document findings and process flows to create baseline for new technology platforms.
- Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis.
- Updates customer assembly application notes.
- MS Degree in Material Science, Chemical Engineering, Semiconductor Processes or other relevant technical field.
- Strong communication skills.
- Ability to lead development projects and implement strategies on a global basis.
- Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding.
- Knowledge of materials and material interactions.
- Strong English conversational skills.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
Frequently Asked Questions
Is the salary disclosed for the SiC Wafer & Package Technology Development Engineer position at onsemi?
The salary for this SiC Wafer & Package Technology Development Engineer role at onsemi is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the SiC Wafer & Package Technology Development Engineer position at onsemi located?
This SiC Wafer & Package Technology Development Engineer role at onsemi is based in Hsinchu City, Taiwan. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the SiC Wafer & Package Technology Development Engineer role at onsemi full-time or part-time?
This is listed as a Full time position. It is posted as a SiC Wafer & Package Technology Development Engineer role at onsemi.
How do I apply for the SiC Wafer & Package Technology Development Engineer position at onsemi?
Click the "Apply Now" button on this page. You will be redirected to onsemi's official application portal hosted on oraclecloud where you can submit your application directly.
When was the SiC Wafer & Package Technology Development Engineer job at onsemi posted?
This SiC Wafer & Package Technology Development Engineer position at onsemi was posted on Sep 29, 2026. Apply as soon as possible — early applications are often reviewed first.
SiC Wafer & Package Technology Development Engineer
onsemi
You'll be redirected to onsemi's official application page on oraclecloud.