Senior Technical Architect

Job Summary

Pod 10 — Integration/Image — Lead
Pod / Track    Pod 10 — Integration/Image
Role Title    Lead — System Integration & Release Image Engineering
Experience    8 – 10 years
Primary Location    Hyderabad, India (Transition phase); HCLTech Offshore Delivery Center thereafter
Work Model    Physical co-location at Hyderabad mandatory during Transition (Month 1–3) for knowledge transfer and hardware/lab access; delivery shifts to HCLTech's Offshore Delivery Center (ODC) from Shadow (Month 4–6) onward.
Role Summary
Own system integration and software image sustenance — build system, image packaging/release, and cross-pod integration validation before every sustenance release.
Key Responsibilities
•    Own the build system (Yocto/OpenEmbedded) and image-packaging pipeline.
•    Own CI/CD pipelines and Gerrit code-review integration across the release train, including build sanity checks.
•    Maintain Yocto meta-layers/meta-targets and shared component libraries used across pods.
•    Coordinate integration of all 10 pods' deliverables into a single release image.
•    Manage release branching, versioning, and OTA image generation.
•    Triage integration-level build and boot failures back to owning pods.
•    Own release notes and image-level regression sign-off, and mentor the pod's Senior Engineers.
Must-Have Skills
•    8–10 years embedded build/release engineering.
•    Yocto/OpenEmbedded build systems.
•    Image packaging and OTA tooling.
•    Release and version management.
•    Cross-team integration coordination.
•    CI/CD pipeline tooling (Jenkins/Gerrit or equivalent) and Yocto meta-layer/meta-target maintenance.
Good-to-Have Skills
•    OTA update system design (A/B partitioning, delta updates).
•    Container/appliance packaging for edge devices.
•    Release engineering across multi-pod dependency graphs.
•    Component library management across a multi-pod Yocto meta-layer structure.
 

Key Responsibilities

Pod 10 — Integration/Image — Lead
Pod / Track    Pod 10 — Integration/Image
Role Title    Lead — System Integration & Release Image Engineering
Experience    8 – 10 years
Primary Location    Hyderabad, India (Transition phase); HCLTech Offshore Delivery Center thereafter
Work Model    Physical co-location at Hyderabad mandatory during Transition (Month 1–3) for knowledge transfer and hardware/lab access; delivery shifts to HCLTech's Offshore Delivery Center (ODC) from Shadow (Month 4–6) onward.
Role Summary
Own system integration and software image sustenance — build system, image packaging/release, and cross-pod integration validation before every sustenance release.
Key Responsibilities
•    Own the build system (Yocto/OpenEmbedded) and image-packaging pipeline.
•    Own CI/CD pipelines and Gerrit code-review integration across the release train, including build sanity checks.
•    Maintain Yocto meta-layers/meta-targets and shared component libraries used across pods.
•    Coordinate integration of all 10 pods' deliverables into a single release image.
•    Manage release branching, versioning, and OTA image generation.
•    Triage integration-level build and boot failures back to owning pods.
•    Own release notes and image-level regression sign-off, and mentor the pod's Senior Engineers.
Must-Have Skills
•    8–10 years embedded build/release engineering.
•    Yocto/OpenEmbedded build systems.
•    Image packaging and OTA tooling.
•    Release and version management.
•    Cross-team integration coordination.
•    CI/CD pipeline tooling (Jenkins/Gerrit or equivalent) and Yocto meta-layer/meta-target maintenance.
Good-to-Have Skills
•    OTA update system design (A/B partitioning, delta updates).
•    Container/appliance packaging for edge devices.
•    Release engineering across multi-pod dependency graphs.
•    Component library management across a multi-pod Yocto meta-layer structure.
 

Skill Requirements

Other Requirements