Senior Principal Foundry Engineer - HV/BCD Process Integration

Operations 3rd Party Foundries :
- Co-ordinate all Wafer Manufacturing related activities.
- Ensure available capacity is in place to cover both STP and LTP volumes. Taking into account type split and capacity bottlenecks.
- Drive BBSC for all 3rdParty Foundries for Delivery, through put time, Yield and Quality including follow up on improvement actions
- Monitor, review and manage any process changes/improvements supporting requests both from 3rd Party Foundries to BL’s and from BL’s to 3rd Party Foundries.
Co-ordinate and drive solutions to customer complaints hold lots and yield/processing excursions related to 3rdParty Foundry ensuring route cause is understood and corrective actions are in place.
 
Program management 3rdParty Foundries:
- Define time-line, resources, risk-mitigations (technical & non technical)activities to ensure timely and satisfactory completion of the project
- Be responsible for monitoring and controlling the execution of the project as per agreed time-line
- Drive all new product transfers activities in External Foundries with support of NXP project team (Innovation, mother fab, BL) and local project team of External Foundry
- Actively coordinate process qualification, product introduction and qualification
- Stimulate/oversee structural problems solving by use of statistical and quality tools
- Chair and organize process gate meetings
- Report to NXP stakeholders and External Foundries counterparts (PRB/Steering Committee)
- Be the interface between NXP and External Foundries during project execution
- Coordinate safe-launch and volume ramp-up implementation, monitor with support of the local technical team continuous yield & process improvement activities
 
General areas of responsibility include:
- Relation management and communication interface to all 3rdParty Foundries within their area.
- Drive Quarterly review with 3rdParty Foundries including follow up on actions
- Support Foundry Sourcing group in cost/price negotiations and discussions with both existing and new 3rd Party Foundries
 
Job Requirement :
Minimum Qualifications:
- Bachelor/Master in Engineering/Material Science/Electronic
- Minimum 7 years working experience preferably in semiconductor fab environment (Process Integration, Device/Yield engineer preferred)
- Well verse in English and Chinese. This role involves regular interaction with Mandarin-speaking suppliers. Therefore, fluency in spoken Mandarin is required to facilitate effective communication and stakeholder engagement.
- Able to work independently and also handle cross functional projects
 
Preferred Qualifications:
- Six sigma green belt and above, SPC knowledge, Semiconductor Devices and Process knowledge
- Knows statistical tool KLA ACE XP, JMP, SPS etc

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