SFC (MES) Domain Leader – Wafer Fabs
Texas Instruments
Senior Die Bond/Die Attach Equipment Engineer
About this role
Change the world. Love your job.
Do you want to work for an organization that values your opinion? Do you want to work for an organization where you can play a pivotal role in several different areas? Look no further. As a Texas Instruments Equipment Engineer, you will have the opportunity to work in a vibrant and dynamic team oriented environment.
Responsibilities include:
- Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products
- Overseeing the installation, modification, upgrade and maintenance of manufacturing equipment
- Keeping current on equipment manufacturers' technical notices, upgrades and safety issues
- Studying equipment performance and reliability
- Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process
- Providing technical support to the manufacturing equipment repair and process engineering organizations
- Defining and writing preventative maintenance schedules
Minimum Requirements:
- Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
- Minimum of 5 years of die bond or die attach equipment hands on experiences
Why TI?
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
Frequently Asked Questions
Is the salary disclosed for the Senior Die Bond/Die Attach Equipment Engineer position at Texas Instruments?
The salary for this Senior Die Bond/Die Attach Equipment Engineer role at Texas Instruments is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the Senior Die Bond/Die Attach Equipment Engineer position at Texas Instruments located?
This Senior Die Bond/Die Attach Equipment Engineer role at Texas Instruments is based in Wilayah Persekutuan Kuala Lumpur, Malaysia. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
How do I apply for the Senior Die Bond/Die Attach Equipment Engineer position at Texas Instruments?
Click the "Apply Now" button on this page. You will be redirected to Texas Instruments's official application portal hosted on oraclecloud where you can submit your application directly.
When was the Senior Die Bond/Die Attach Equipment Engineer job at Texas Instruments posted?
This Senior Die Bond/Die Attach Equipment Engineer position at Texas Instruments was posted on Sep 4, 2026. Apply as soon as possible — early applications are often reviewed first.
Senior Die Bond/Die Attach Equipment Engineer
Texas Instruments
You'll be redirected to Texas Instruments's official application page on oraclecloud.