Process Engineering Manager (Electroplating)

amat· 0091 Applied Materials Singapore Technology Pte. Ltd.
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📍 Singapore,SGPFull time

About this role

Who We Are


Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. 


What We Offer


Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join our Singapore's Advanced Packaging Development Center (APDC) team. This role will lead the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging applications. The successful candidate will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global cross-functional teams to deliver differentiated products and technology solutions.

Key Responsibilities

  • Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products

  • Manage, develop, plan and execute process engineering projects for entire range of products

  • Interact with key customers to resolve significantly complex process engineering issues for entire range of products

  • Develop and implement new technology, products and analytical instrumentation

  • Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products

  • Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products

  • Contributes to market share gains through technology improvement

Requirements

  • Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.

  • 8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition technologies.

  • Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.

  • Proven experience leading process development, technology innovation, and product qualification in an R&D environment.

  • Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.

  • Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.

  • Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.

  • Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.

  • Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.

Work Location

  • Science Park II (Moving to Tampines office starting Apr 2027)

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

Frequently Asked Questions

Is the salary disclosed for the Process Engineering Manager (Electroplating) position at amat?
The salary for this Process Engineering Manager (Electroplating) role at amat is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the Process Engineering Manager (Electroplating) position at amat located?
This Process Engineering Manager (Electroplating) role at amat is based in Singapore,SGP. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Process Engineering Manager (Electroplating) role at amat full-time or part-time?
This is listed as a Full time position. It is posted as a Process Engineering Manager (Electroplating) role in the 0091 Applied Materials Singapore Technology Pte. Ltd. department at amat.
Which team or department does the Process Engineering Manager (Electroplating) at amat belong to?
This Process Engineering Manager (Electroplating) position is part of the 0091 Applied Materials Singapore Technology Pte. Ltd. department at amat. See the full job description for more information about the team structure and responsibilities.
How do I apply for the Process Engineering Manager (Electroplating) position at amat?
Click the "Apply Now" button on this page. You will be redirected to amat's official application portal hosted on workday where you can submit your application directly.
When was the Process Engineering Manager (Electroplating) job at amat posted?
This Process Engineering Manager (Electroplating) position at amat was posted on Sep 14, 2026. Apply as soon as possible — early applications are often reviewed first.
Process Engineering Manager (Electroplating)
amat
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