Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging)

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📍 SAN JOSEFull time💰 USD 140K–260K

About this role

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Job Title:                                                            Principal Product Engineer

Location:                                                           San Jose, California, United States

Reports to:                                                       Product Engineering Director

 

 

Job Overview:

As Product Engineer, you are responsible for driving the definition, early deployment, and broader adoption of the Cadence Virtuoso Heterogeneous Integration technologies. You work with strategic customers, Product Management, R&D, Product Validation, and Application Engineering teams to define requirements, validate solutions, and accelerate customer success in physical implementation flows for 3D IC, heterogeneous integration, and advanced packaging.

 

Job Responsibilities:


  • Drive, validate, and promote an end-to-end solution for system design implementation flows spanning 3D IC, heterogeneous integration and advanced packaging.
  • Partner with leading semiconductor customers to understand complex system co-design challenges and translate them into clear product specifications.
  • Produce high-quality Product Requirement Specifications (PRS), technical use cases, and support R&D throughout product development.
  • Collaborate cross-functionally with R&D, Product Management, Field teams, Technical Publications and Product Validation to deliver robust, customer-ready capabilities.
  • Create and deliver demonstration collateral, application workflows, and enablement materials to accelerate customer and field adoption.
  • Troubleshoot design-flow issues, provide technical guidance and workarounds, and drive bug/enhancement prioritization.
  • Support product launches, customer engagements, and industry events.
  • Own deliverables from definition through customer deployment with a strong focus on execution and accountability.

 

Job Qualifications:


  • BS in Electrical Engineering, Electronics, or a related technical field.
  • Strong experience in semiconductor design, physical implementation, advanced packaging, or EDA product engineering.
  • Strong hands-on knowledge of the Cadence Virtuoso platform and associated custom IC design flows.
  • 10+ years of relevant experience, or equivalent demonstrated expertise.
  • Proven ability to work independently, prioritize effectively, and take responsibility for technical deliverables.
  • Strong verbal and written communication skills, with the ability to collaborate effectively across global and multicultural teams, and across functions.
  • Highly motivated by the rapidly evolving landscape of 3DIC, heterogeneous integration, and advanced packaging technologies, with a passion for driving innovation in next-generation semiconductor solutions.

 

Additional Skills/Preferences:                            

  • Experience with software product definition, validation, or technical marketing activities.
  • Experience with co-design flows around 3D IC, heterogeneous integration, silicon-package-board integration.
  • Knowledge of Cadence Allegro Package Designer Plus (APD+) and package implementation methodologies.
  • Knowledge of Cadence Virtuoso SKILL language or any other interpreted language.

 

Additional Information:

Cadence is committed to equal employment opportunity and employment equity throughout all levels of the organization. We strive to attract a qualified and diverse candidate pool and encourage diversity and inclusion in the workplace. 

 


The annual salary range for California is $140,000 to $260,000. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.

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Frequently Asked Questions

What is the salary for the Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging) role at cadence?
The listed salary for this Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging) position at cadence is USD 140K–260K. This is an Full time role.
Where is the Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging) position at cadence located?
This Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging) role at cadence is based in SAN JOSE. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging) role at cadence full-time or part-time?
This is listed as a Full time position. It is posted as a Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging) role at cadence.
How do I apply for the Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging) position at cadence?
Click the "Apply Now" button on this page. You will be redirected to cadence's official application portal hosted on workday where you can submit your application directly.
When was the Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging) job at cadence posted?
This Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging) position at cadence was posted on Sep 24, 2026. Apply as soon as possible — early applications are often reviewed first.
Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging)
cadence · 💰 USD 140K–260K
Apply for this role ↗

You'll be redirected to cadence's official application page on Workday.