Principal Assembly Automation Equipment Eng

We are looking for a Principal Assembly Automation Equipment Engineer with deep expertise in Assembly and Test Equipment for monolithically integrated optical circuits (PIC- Photonic Integrated Circuit) in 24x7 manufacturing. This role will lead and develop resources in sourcing , procurement , and qualification of automated assembly and test equipment. Define critical gaps for challenging assembly needs and ensure that forecasted equipment capability and capacity requirements can be met. You will work closely with cross-functional teams to ensure robust, scalable manufacturing processes that meet performance, reliability, and cost requirements for high-volume production.

Key Responsibilities:

Assembly and Test  Equipment Development & Sustaining Engineering.

• Experienced in equipment utilized through semiconductor lasers back end such as dicing, AR coating, COC assembly, test and BI equipment, etc.

• Experienced in working with oversea contractors or CM partners to coordinate and support equipment deployment on time.

• Lead capital equipment procurement process to support production and NPI needs. This includes source equipment, vendor development, feasibility studies, work with process owners to define FAT/SAT plans and conduct onsite acceptance validations as required.

• Improve equipment efficiency, utilization, and cost, through initiatives for automation, standardization, optimization or engagement of new technologies.

• Develop and manage business relationships with key equipment vendors.

• Lead new equipment development to support R&D or production needs.

• Lead equipment maintenance team, minimize equipment down time, implement routine PM discipline, manage critical spare parts inventory, coach equipment technicians.

• Work closely with PIC (Photonic Integrated Circuit) development and downstream package design group on NPI assembly requirements.

• Tool Ownership. Responsible for Machine performance and Uptime.

• Using Statistical Process Control (SPC) and data analysis to reduce process variation and ensure the machine produces consistent parts within defined specs. 

Documentation & Control

• Develop and maintain assembly test equipment documentation form machine operation, preventive maintenance and equipment calibration.
• Ensure equipment and test compliance with internal and customer quality standards.

Qualifications/Skills/Experience:

• Bachelor’s degree in Electrical, Mechanical Engineering, or related field, plus 15 years of related experience in semiconductor packaging & assembly technology in a manufacturing environment.
• Strong hands-on background and experience in assembly equipment and processes for microelectronics manufacturing.
• Background in semiconductor or photonic device manufacturing, process control, and statistical tools (SPC and DOE).
• Hands-on Troubleshooting and resolving equipment related line downs.