PIM (Si Gel Filled) Power Module Development Engineer
About this role
- New package technology and platform module development (Si-gel filled module).
- Technical leadership on new power module technology and enabling technology for automotive/industrial application.
- Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
- Package/design review for new package development, on-tme release with the first pass success (qualification).
- Present technical finding, design review and recommendation to stakeholders and management.
- Lead package related failure analysis, reliability testing and debug package issues.
- Participate in customer meeting, provide technical clarification and support failure investigation.
- Define power module package strategy aligned with product roadmap.
- Own end-to-end package development from concept to qualification upon company's package development procedures.
- Ensure package reliability, performance, and manufacturability.
- Establish and optimize packaging processes and specifications.
- Collaborate with cross-functional teams (design, wafer fab, test, product engineering).
- Evaluate and introduce new packaging technologies and materials.
- Manage risk, cost, and schedule for packaging programs.
- Support customer engagement for technical discussions and issue resolution.
- Serve as subject matter expert (SME) for packaging within the organization.
- Minium Bachelor's degree of material science or mechanical engineering.
- More than 8 years of power module package development experience including transfer to the production.
- Preferred Si gel filled module package development experience with SiC device.
- Good statistical analysis skills with Minitab or JMP.
- Preferred the knowledge to use Auto CAD software
- Good communication skills with English.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
Frequently Asked Questions
Is the salary disclosed for the PIM (Si Gel Filled) Power Module Development Engineer position at onsemi?
The salary for this PIM (Si Gel Filled) Power Module Development Engineer role at onsemi is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the PIM (Si Gel Filled) Power Module Development Engineer position at onsemi located?
This PIM (Si Gel Filled) Power Module Development Engineer role at onsemi is based in Shenzhen, Guangdong, China, Suzhou, Jiangsu, China. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the PIM (Si Gel Filled) Power Module Development Engineer role at onsemi full-time or part-time?
This is listed as a Full time position. It is posted as a PIM (Si Gel Filled) Power Module Development Engineer role at onsemi.
How do I apply for the PIM (Si Gel Filled) Power Module Development Engineer position at onsemi?
Click the "Apply Now" button on this page. You will be redirected to onsemi's official application portal hosted on oraclecloud where you can submit your application directly.
When was the PIM (Si Gel Filled) Power Module Development Engineer job at onsemi posted?
This PIM (Si Gel Filled) Power Module Development Engineer position at onsemi was posted on Jun 17, 2026. Apply as soon as possible — early applications are often reviewed first.
PIM (Si Gel Filled) Power Module Development Engineer
onsemi
You'll be redirected to onsemi's official application page on oraclecloud.