Packaging Module Development Engineer

intel· 100 Intel Corporation
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📍 US, Arizona, PhoenixFull time💰 USD 134K–255K

About this role

Job Details:

Job Description: 

Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and intelligence. With a legacy of over 50 years of technological breakthroughs, Intel is committed to creating world-changing technology that improves the lives of every person on the planet. Our culture is built on inclusion, collaboration, and a relentless pursuit of what's next. At Intel, your work matters — and so do you.

 

Are you passionate about advancing semiconductor packaging technology? Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a Packaging Module Development Engineer specializing in Laser and Optical Processing to join our pilot line in Chandler, Arizona.

 

In this role, you will develop and integrate next-generation laser and optical process technologies that enable Intel's most advanced packaging solutions. Working with world-class engineers and researchers, you will directly influence the performance, reliability, and manufacturability of future semiconductor products.

 

Key Responsibilities

  • Develop and optimize laser, optical, and advanced packaging processes for next-generation semiconductor technologies.
  • Design and execute experiments, analyze data, and drive process improvements using scientific and statistical methods.
  • Support the installation, qualification, and ramp of new equipment and process technologies.
  • Investigate process and equipment issues, perform root-cause analysis, and implement solutions to improve yield and reliability.
  • Collaborate across engineering teams and document technical findings to support technology development and manufacturing readiness.

 

As a Successful Candidate, You Will Bring:

  • A natural collaborator – You thrive in team environments and build strong relationships across functions and disciplines.
  • Curious and innovative – You approach challenges with an open mind and a drive to find creative, data-driven solutions.
  • Detail-oriented – You take pride in precision and thoroughness in everything from experimental design to documentation.
  • An effective communicator – You can translate complex technical findings into clear, actionable insights for diverse audiences.
  • Resilient and adaptable – You remain focused and solutions-oriented in a fast-paced, ever-evolving environment.
  • A self-starter – You take ownership of your work and proactively identify opportunities for improvement without waiting to be asked.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.


Minimum Qualifications:

To be initially considered for this position, candidates must meet one of the following education and experience thresholds:

  • Ph.D. in Optical Engineering, Optics, Photonics, Physics, Applied Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related STEM field (recent graduates with academic lab/dissertation research in laser processing, optics, or laser-material interaction are strongly encouraged to apply); OR Master's degree in the above STEM disciplines with 1+ years of relevant experience (which may include graduate thesis research, academic lab projects, or industry internships); OR Bachelor's degree in the above STEM disciplines with 3+ years of relevant industry experience in laser processing, precision equipment engineering, or semiconductor manufacturing.
  • Relevant experience will be:
  • Hands-on experience working with laser, optical, photonic, or related advanced processing technologies in a laboratory, manufacturing, or development environment.
  • Proficiency in programming or scripting tools (e.g., Python, MATLAB, JMP/JSL, C++, LabVIEW) for data analysis, process development, automation, or equipment control.
  • Experience applying experimental methods (DOE), statistical analysis, and data-driven problem-solving to technical challenges.
  • Strong analytical, troubleshooting, and communication skills, with attention to detail and a structured approach to process development.
  • Experience applying experimental methods, statistical analysis, and data-driven problem-solving to technical challenges.

 

Preferred Qualifications:

  • 4+ years of:
  • Experience developing laser, optical, or precision micromachining processes for semiconductor, microelectronics, advanced materials, or related applications.
  • Understanding of laser-material interactions (e.g., ultrafast pulse dynamics, non-linear optical absorption, thermal vs. athermal ablation regimes, or laser-assisted surface finishing).
  • Experience with JMP Scripting Language (JSL) or custom scripting for automated reporting, coordinate translation, toolpath generation, or recipe automation.
  • Hands-on operation of 3D optical profilers, confocal microscopes, or surface metrology tools to evaluate micro-features, step heights, and surface roughness.
  • Familiarity with optical modeling tools or multi-physics simulation software (e.g., COMSOL, ANSYS) for thermal or optical-mechanical modeling.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Frequently Asked Questions

What is the salary for the Packaging Module Development Engineer role at intel?
The listed salary for this Packaging Module Development Engineer position at intel is USD 134K–255K. This is an Full time role.
Where is the Packaging Module Development Engineer position at intel located?
This Packaging Module Development Engineer role at intel is based in US, Arizona, Phoenix. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Packaging Module Development Engineer role at intel full-time or part-time?
This is listed as a Full time position. It is posted as a Packaging Module Development Engineer role in the 100 Intel Corporation department at intel.
Which team or department does the Packaging Module Development Engineer at intel belong to?
This Packaging Module Development Engineer position is part of the 100 Intel Corporation department at intel. See the full job description for more information about the team structure and responsibilities.
How do I apply for the Packaging Module Development Engineer position at intel?
Click the "Apply Now" button on this page. You will be redirected to intel's official application portal hosted on workday where you can submit your application directly.
When was the Packaging Module Development Engineer job at intel posted?
This Packaging Module Development Engineer position at intel was posted on Sep 29, 2026. Apply as soon as possible — early applications are often reviewed first.
Packaging Module Development Engineer
intel · 💰 USD 134K–255K
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