塑封工艺工程师/Molding Process Engineer

Texas Instruments
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📍 Chengdu, Sichuan, China

About this role

岗位职责： 
1. 负责半导体Molding（环氧塑封）工序全流程工艺管控、参数优化、量产制程维护； 
2. 解决塑封工序溢料、空洞、分层、翘曲、封装开裂等工艺量产不良； 
3. 负责塑封料物料验证、固化工艺优化、产品外观及电性一致性管控； 
4. 编制塑封工序工艺标准、生产管控文件，推进制程能力CPK提升； 
5. 参与封装产品结构评审、新产品塑封方案落地与试产跟进。。 

任职基本要求： 
1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 
2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 
3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 
4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 

加分项： 

熟悉车载芯片塑封工艺、抗潮耐温塑封制程经验优先。

Why TI?
  • Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
  • We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
  • Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here

About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

If you are interested in this position, please apply to this requisition.

Frequently Asked Questions

Is the salary disclosed for the 塑封工艺工程师/Molding Process Engineer position at Texas Instruments?
The salary for this 塑封工艺工程师/Molding Process Engineer role at Texas Instruments is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the 塑封工艺工程师/Molding Process Engineer position at Texas Instruments located?
This 塑封工艺工程师/Molding Process Engineer role at Texas Instruments is based in Chengdu, Sichuan, China. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
How do I apply for the 塑封工艺工程师/Molding Process Engineer position at Texas Instruments?
Click the "Apply Now" button on this page. You will be redirected to Texas Instruments's official application portal hosted on oraclecloud where you can submit your application directly.
When was the 塑封工艺工程师/Molding Process Engineer job at Texas Instruments posted?
This 塑封工艺工程师/Molding Process Engineer position at Texas Instruments was posted on Jul 16, 2026. Apply as soon as possible — early applications are often reviewed first.
塑封工艺工程师/Molding Process Engineer
Texas Instruments
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