Media Architecture and Integration Engineer (NAND/SSD)

Company Description

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.

Job Description

Job role is to help deliver optimized NAND components for wafer-sales customers. From NAND architecture pathfinding to final component qualification the team works to deliver die that will create world class SSDs. Day to day work is direct experimentation and problem solving along with analytics of large datasets. Data can range from Fab test data, to customer SSD telemetry. Memory experience is a must along with some comfort in coding. Direct customer interaction in China is expected as well as collaboration with US based teams.

Key Responsibilities: 

• Deep product knowledge of all features\specifications
• Understanding of component use cases for features in downstream customers
• NAND to System performance interaction
• Basic Disturb\REL physics comprehension
• Main Point of Contact for customer issues and bring up
• May require onsite support with local customers
• SW: Python Fluent, C\C++ literate, Git, JMP, JIRA

Qualifications

• Degree in Electrical Engineering, Physics, Material Science, Microelectronics or a related field. 
• Understanding of NAND array / product operations, and product characterization and specs validation. 
• Knowledge and good understanding of semiconductor device physics, solid-state physics and reliability physics. 
• Knowledge of semiconductor process flows. 
• Good statistical analysis skills. 
• Knowledge and abilities of programming languages (C, C++, Python). 
• Ability to work in a cross-functional team environment. 
• Good problem-solving skills. 
• Good communication and presentation skills. 

Additional Information

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