Manufacturing Process Development Engineer-Wafer Cleaving Operation

lumentum· Lumentum Operations LLC
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📍 USA - NC- GreensboroFull time💰 USD 90K–166K

About this role

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

We are seeking an experienced Process Engineer to lead processing of singulation and facet preparation on edge emitting laser components through the back end of line.  This role will both sustain existing processes and develop processes for new technologies.

Role and Responsibilities:

Wafer singulation:

  • Process development for wafer cleaving operation
  • Own and sustain processing of thinned wafers through the singulation and facet coating preparation
  • Establish and maintain processes, specifications, SPC controls, FMEAs and OCAPs

Facet Processing:

  • Develop and sustain pick and place processes and equipment
  • Develop and sustain bar stacking/unstacking to and from fixtures for facet processing

Manufacturing Support & Yield Improvement:

  • Provide real‑time engineering support for thinning operations in high‑volume manufacturing
  • Lead response to process excursions, tool issues, and product at‑risk situations using structured problem‑solving methods
  • Investigate yield losses, defects, and reliability issues and implement corrective and preventative actions
  • Utilize SPC, DOE, and statistical analysis tools to identify root causes and improvement opportunities

Required Qualifications:

  • B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering or related discipline
  • 5+ years of industrial experience supporting semiconductor or advanced manufacturing processes

Preferred Experience & Skills:

  • Experience in semiconductor wafer fabrication
  • Experience with wafer die singulation
  • Experience with pick and place equipment and die handling practices
  • Familiarity with automation and advanced process control
  • Proficiency with JMP, Excel, SQL, Python, or similar data tools
  • Excellent written and verbal communication skills, including technical documentation

Salary Range:
The salary range for this position is $89,650 – $166,000USD. Final compensation will be determined based on factors such as experience, skills, and qualifications

We are an equal opportunity employer and value diversity at our company.

We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.

We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.

Please contact us to request accommodation.

Frequently Asked Questions

What is the salary for the Manufacturing Process Development Engineer-Wafer Cleaving Operation role at lumentum?
The listed salary for this Manufacturing Process Development Engineer-Wafer Cleaving Operation position at lumentum is USD 90K–166K. This is an Full time role.
Where is the Manufacturing Process Development Engineer-Wafer Cleaving Operation position at lumentum located?
This Manufacturing Process Development Engineer-Wafer Cleaving Operation role at lumentum is based in USA - NC- Greensboro. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Manufacturing Process Development Engineer-Wafer Cleaving Operation role at lumentum full-time or part-time?
This is listed as a Full time position. It is posted as a Manufacturing Process Development Engineer-Wafer Cleaving Operation role in the Lumentum Operations LLC department at lumentum.
Which team or department does the Manufacturing Process Development Engineer-Wafer Cleaving Operation at lumentum belong to?
This Manufacturing Process Development Engineer-Wafer Cleaving Operation position is part of the Lumentum Operations LLC department at lumentum. See the full job description for more information about the team structure and responsibilities.
How do I apply for the Manufacturing Process Development Engineer-Wafer Cleaving Operation position at lumentum?
Click the "Apply Now" button on this page. You will be redirected to lumentum's official application portal hosted on workday where you can submit your application directly.
When was the Manufacturing Process Development Engineer-Wafer Cleaving Operation job at lumentum posted?
This Manufacturing Process Development Engineer-Wafer Cleaving Operation position at lumentum was posted on Aug 27, 2026. Apply as soon as possible — early applications are often reviewed first.
Manufacturing Process Development Engineer-Wafer Cleaving Operation
lumentum · 💰 USD 90K–166K
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You'll be redirected to lumentum's official application page on Workday.