Junior Mechanical Engineer

Job Description

The Junior Thermal Research Engineer is responsible for supporting the design, modeling, and experimental validation of advanced thermal management systems for next-generation electronics cooling applications in data center, semiconductor test and aerospace and defense applications. The role combines thermal system design, modeling, experimentation, and data science techniques, with a focus on enabling faster design cycles and improved system-level insight.

• Support the design and development of thermal management systems, including liquid cooling, two-phase cooling, and heat exchanger based architectures
• Cooling system design including cold plates, cooling distribution units (CDUs) and passive two-phase solutions (heat pipes and vapor chambers)
• Develop and apply thermal-fluid modeling tools (steady-state and transient) for system-level performance prediction, including pressure drop, heat transfer, and coolant distribution
• Implement and use machine learning, AI and data-driven methods
• Support data center cooling system modeling, including rack-level and component-level thermal architecture analysis
• Conduct design of experiments (DOE) and support experimental testing, including instrumentation, data acquisition, and validation of models
• Create and maintain CAD models and engineering documentation (e.g., SolidWorks designs, P&IDs, drawings, and test plans)
• Assist in development of computational tools and simulation frameworks (Python, MATLAB) to support engineering decision-making and research activities
• Support prototype development and testbed construction, including integration of thermal systems and measurement capabilities
• Collaborate with senior engineers and researchers to evaluate new cooling technologies, improve system efficiency and performance and identify key design tradeoffs

Basic (Required Qualifications)

• Bachelors or Masters in Mechanical Engineering or a related field.
• 0-2 years of relevant experience or thermal course work.

• Eaton will not consider applicants for employment, immigration sponsorship or support for this position. This means that Eaton will not support any CPT, OPT, or STEM OPT plans, F-1 to H-1B, H-1B cap registration, O-1, E-3, TN status, I-485 job portability, etc.”  
• No relocation is offered for this position. Candidates must reside within 60 miles of Lancaster PA to be considered.  

Preferred Qualifications

• Master’s or PhD in Mechanical Engineering or a related field.
• Academic focus in heat transfer, fluid dynamics, and thermal systems.
• Laboratory and experimental research experience.
• Graduate research in thermal-fluid sciences, cooling technologies, or electronics cooling strongly preferred.
• Exposure to data center cooling and/or high-performance electronics thermal management.
• Experience developing reduced-order or surrogate thermal models.
• Knowledge of optimization-driven design methodologies.
• Ability to integrate simulation, modeling, and experimental validation.
• All positions require use of information or access to hardware which is subject to the International Traffic in Arms regulations. All applicants must be U.S. Persons within the meaning of ITAR. ITAR defines a U.S. Person as a U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee.

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EEO Statement

Boyd Corp is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.