Internship - Reliability of Advanced Semiconductor Packages

nxp· NL61 NXP Semiconductors Netherlands BV
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📍 NijmegenFull time

About this role

Understanding the reliability of advanced laminate-based electronic packages at NXP

We are looking for a highly motivated student that will help us with investigating and understanding the boundaries of the reliability of advanced laminate-based electronic packages with complex multi-material interfaces. These packages may be exposed to humidity with electrical bias and/or thermo-mechanical loading over long durations. It is essential to understand the underlying degradation with failure analysis techniques and failure mechanisms in order to assess the reliability of these systems in real-world applications (e.g. automotive and industrial).

 

Your team

This opportunity is within the Product Quality & Diagnostic Center (PDQC) team. PDQC’s mission is to ensure robust product quality and reliability throughout development and qualification, enabling successful introduction of new technologies into production. PDQC accomplishes this mission through several key objectives:

·        Drive product qualification and reliability assessment for new technology developments.

·        Support failure analysis and root cause understanding across development and qualification phases.

·        Define and implement reliability test methods, hardware, and evaluation strategies.

·        Enable continuous improvement of product robustness through data-driven insights and collaboration.

 

What’s in it for you

·        A great opportunity to develop your skills (technical, soft skills, communication, etc.).

·        Gaining experience in a multinational and diverse environment.

·        Working on real assignments which contribute to NXP’s objectives.

Your Profile

·        Internship for Master of Science in Microelectronics

·        Affinity with semiconductor, reliability and physics.

·        Team player, willing to work in international and multi-disciplinary teams.

·        Flexible and able to multi-task.

·        Excellent communication skills, both verbal and written in English.

More information about NXP in the Netherlands...

#LI-3623

Frequently Asked Questions

Is the salary disclosed for the Internship - Reliability of Advanced Semiconductor Packages position at nxp?
The salary for this Internship - Reliability of Advanced Semiconductor Packages role at nxp is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the Internship - Reliability of Advanced Semiconductor Packages position at nxp located?
This Internship - Reliability of Advanced Semiconductor Packages role at nxp is based in Nijmegen. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Internship - Reliability of Advanced Semiconductor Packages role at nxp full-time or part-time?
This is listed as a Full time position. It is posted as a Internship - Reliability of Advanced Semiconductor Packages role in the NL61 NXP Semiconductors Netherlands BV department at nxp.
Which team or department does the Internship - Reliability of Advanced Semiconductor Packages at nxp belong to?
This Internship - Reliability of Advanced Semiconductor Packages position is part of the NL61 NXP Semiconductors Netherlands BV department at nxp. See the full job description for more information about the team structure and responsibilities.
How do I apply for the Internship - Reliability of Advanced Semiconductor Packages position at nxp?
Click the "Apply Now" button on this page. You will be redirected to nxp's official application portal hosted on workday where you can submit your application directly.
When was the Internship - Reliability of Advanced Semiconductor Packages job at nxp posted?
This Internship - Reliability of Advanced Semiconductor Packages position at nxp was posted on Sep 8, 2026. Apply as soon as possible — early applications are often reviewed first.
Internship - Reliability of Advanced Semiconductor Packages
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