ENGR II, MANUFACTURING EQUIP; MFG

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📍 Seremban, Negeri Sembilan, MalaysiaFull time

About this role

We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM equipment and front end assembly processes.

Technician Leadership: Lead, supervise, and mentor a team of shift technicians to ensure strict adherence to maintenance schedules and production KPIs.
Machine Issue Follow-up: Take ownership of chronic, unresolved, or escalated machine issues handed over from previous shifts, conducting deep-dive root cause analysis for permanent resolution.
Equipment Maintenance & Calibration: Oversee and execute corrective and preventive maintenance (PM) for die attach, clip bond, reflow, oven, and AOI equipment to minimize downtime.
Process Optimization: Monitor Overall Equipment Effectiveness (OEE),Uptime,production time.
Documentation: Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials for the engineering team.
 

Candidates must have hands-on experience in operation, setup, troubleshooting, or maintenance for the following equipment:
Die Bonder: ASM AD838, AD8312PLUS, DA D510, ALPHASAM
Clip Bonder: AD830CB, AD830PLUS, BESTEM-C310
Reflow & Ovens: RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System)
Screen Printer: ASM DEK
Cleaning Systems: CREST, 
Automated Optical Inspection (AOI): PENTAMASTER AOI
    
Requirements:
Education: Bachelor’s Degree in Mechanical, Mechatronics, Electrical, or Electronic Engineering.
Experience: Minimum 3–5+ years of solid engineering experience in semiconductor Front assembly (Die Bond / Clip Bond line preferred).
Technical Skills:
Expertise in ASM die bond platforms, Solder Phasa bonding mechanisms, and vision systems.
Proficient in engineering problem-solving tools (8D, FMEA, SPC, 5-Why, Fishbone).
Leadership: Proven track record of managing shift technicians and driving team performance under pressure.
Working Hours: Must be willing to support shift teams, handle escalations, and work flexible hours when required.
 

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

Frequently Asked Questions

Is the salary disclosed for the ENGR II, MANUFACTURING EQUIP; MFG position at onsemi?
The salary for this ENGR II, MANUFACTURING EQUIP; MFG role at onsemi is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the ENGR II, MANUFACTURING EQUIP; MFG position at onsemi located?
This ENGR II, MANUFACTURING EQUIP; MFG role at onsemi is based in Seremban, Negeri Sembilan, Malaysia. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the ENGR II, MANUFACTURING EQUIP; MFG role at onsemi full-time or part-time?
This is listed as a Full time position. It is posted as a ENGR II, MANUFACTURING EQUIP; MFG role at onsemi.
How do I apply for the ENGR II, MANUFACTURING EQUIP; MFG position at onsemi?
Click the "Apply Now" button on this page. You will be redirected to onsemi's official application portal hosted on oraclecloud where you can submit your application directly.
When was the ENGR II, MANUFACTURING EQUIP; MFG job at onsemi posted?
This ENGR II, MANUFACTURING EQUIP; MFG position at onsemi was posted on Jul 21, 2026. Apply as soon as possible — early applications are often reviewed first.
ENGR II, MANUFACTURING EQUIP; MFG
onsemi
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