ENGINEER SR, PACKAGE DEVELOPMENT

The Senior NPI Assembly Engineer is responsible for executing New Product Introduction (NPI) activities related to semiconductor assembly processes from development through high-volume manufacturing. This role serves as the technical owner for assembly process qualification, process optimization, risk assessment, and production readiness, ensuring new products meet quality, cost, reliability, and manufacturing requirements.

The engineer collaborates closely with Product Engineering, Process Engineering, Quality, Equipment Engineering, Supply Chain, and Customers to ensure successful product transfers, process characterization, and ramp-up activities.

Process Development & Qualification

• Define assembly manufacturing flow, process parameters, and control plans.
• Lead process characterization studies and DOE (Design of Experiments).
• Establish process windows and optimize manufacturing parameters.
• Perform process qualifications according to internal and customer requirements.
• Drive equipment and process readiness for new package introductions.

Assembly Manufacturing Support

• Provide technical leadership for assembly operations including:
  • Die Attach
  • Wire Bond
  • Wafer Saw
  • Molding
  • Trim & Form
  • Singulation
  • Marking
  • Packing
• Troubleshoot process issues during pilot builds and production ramp-up.
• Drive yield improvement and cycle time reduction initiatives.

Reliability & Quality

• Lead failure analysis and root cause investigations for NPI-related issues.
• Support reliability qualification activities such as:
  • HTOL
  • TC
  • HAST
  • MSL
  • Autoclave
• Ensure compliance with automotive, industrial, medical, or consumer quality requirements where applicable.
• Drive corrective and preventive actions (CAPA).

Documentation & Change Management

• Create and maintain:
  • Process Flow
  • FMEA
  • Control Plan
  • Work Instructions
  • Qualification Reports
  • Engineering Specifications
• Support Engineering Change Orders (ECO) and Product Change Notifications (PCN).
• Ensure product documentation is complete before production release.

Continuous Improvement

• Drive yield enhancement and cost reduction initiatives.
• Apply statistical analysis and SPC methodologies for process improvement.
• Implement Lean Manufacturing and Six Sigma practices.
• Benchmark best practices and introduce innovative assembly technologies.

Stakeholder & Customer Interface

• Act as technical focal point for customers during NPI programs.
• Present qualification status, technical risks, and project updates to management and customers.
• Work closely with suppliers on material and equipment qualifications.

Education

• Bachelor's Degree in:
  • Electrical Engineering
  • Electronics Engineering
  • Mechanical Engineering
  • Manufacturing Engineering
  • Materials Engineering
  • Semiconductor-related disciplines

Experience

• Minimum 5-8 years of experience in semiconductor assembly manufacturing or NPI engineering.
• Experience leading new product introductions and product transfers.
• Strong experience in assembly process development and qualification.
• Experience in high-volume semiconductor manufacturing environments.

Technical Knowledge

• Strong knowledge of semiconductor assembly processes.
• Understanding of:
  • Statistical Process Control (SPC)
  • Design of Experiments (DOE)
  • FMEA
  • MSA
  • 8D Problem Solving
  • Root Cause Analysis
  • Reliability Testing
  • Process Qualification Methodologies
• Familiarity with automotive quality requirements such as IATF 16949 and APQP is an advantage.

Technical Skills

• Data analysis using Minitab, JMP, Excel, or equivalent tools.
• Yield improvement and defect reduction methodologies.
• Equipment qualification and process validation.
• Strong understanding of semiconductor package technologies.