Director of SoC Implementation / Physical Design

nxp· US63 NXP USA Inc.
Apply Now ↗
📍 Austin (Oakhill, Office)Full time

About this role

We are seeking a highly experienced leader to head SoC Implementation / Physical Design for advanced semiconductor products. This role will own end-to-end physical design execution across complex SoCs, driving delivery from RTL to silicon for cutting-edge technology nodes.

The ideal candidate combines deep technical expertise with strong organizational leadership, capable of managing large global teams and delivering high-quality silicon on aggressive schedules.

Key Responsibilities

1. End-to-End Physical Design Ownership

  • Lead complete SoC physical design execution including floorplanning, synthesis, place & route, CTS, routing, STA, PDN, PDV and signoff.
  • Drive timing, power, IR/EM, and physical verification closure to achieve tapeout readiness.
  • Deliver optimized PPA (Power, Performance, Area) across complex designs.
  • Aligns with internal expectations of implementing designs on silicon with optimal quality, PPA, and cost efficiency

2. Program & Execution Leadership

  • Own planning, tracking, and execution of physical design programs from specification through tapeout.
  • Manage risks, dependencies, and schedules across multi-site global teams.
  • Drive cross-functional alignment across RTL, DFT, STA, verification, and packaging teams.
  • Ensure delivery to aggressive project timelines and quality metrics.

3. Team Leadership & Organization Development

  • Build and lead high-performing global physical design teams.
  • Drive hiring, mentoring, and career development across technical leads and engineers.
  • Establish execution discipline, review mechanisms, and performance tracking.
  • Interface with senior leadership for status reporting, escalation, and decision-making.

4. Technical Strategy & Innovation

  • Define and deploy next-generation physical design methodologies.
  • Drive automation, flow optimization, and tool innovation.
  • Lead adoption of advanced node technologies (5nm and beyond).
  • Improve scalability, productivity, and design quality through methodology enhancements.

5. Cross-Functional & Ecosystem Engagement

  • Collaborate with architecture, RTL, verification, and product teams to ensure design convergence.
  • Interface with EDA vendors and IP providers for tool and flow optimization.
  • Support post-silicon bring-up, yield improvement, and production ramp activities.

Core Technical Expertise

  • Full RTL-to-GDSII implementation flow
  • Floorplanning, synthesis, PNR, CTS, routing
  • STA and signoff methodologies
  • EM/IR, PDN design, signal integrity
  • Physical verification (DRC/LVS/ERC)
  • Advanced node implementation (≤ 16nm / 5nm)
  • Low power design (UPF/CPF)
  • System-level integration (package, IO, board)

These responsibilities reflect core physical design tasks such as floorplanning, PNR, STA, verification, and optimization defined in internal role descriptions

Required Qualifications

  • Bachelor’s or Master’s in Electrical / Electronics Engineering or related field
  • 17+ years of experience in ASIC / SoC physical design
  • Proven experience leading large-scale SoC programs
  • Strong knowledge of industry EDA tools (Synopsys, Cadence flows)
  • Demonstrated success in advanced node implementations
  • Strong leadership, communication, and stakeholder management skills

Preferred Qualifications

  • Experience in automotive or high-reliability SoCs
  • Expertise in PDN / EMIR / SI closure at chip-level
  • Experience with global team leadership across geographies
  • Exposure to AI-driven design methodologies and automation

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

#LI-6692

Frequently Asked Questions

Is the salary disclosed for the Director of SoC Implementation / Physical Design position at nxp?
The salary for this Director of SoC Implementation / Physical Design role at nxp is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the Director of SoC Implementation / Physical Design position at nxp located?
This Director of SoC Implementation / Physical Design role at nxp is based in Austin (Oakhill, Office). The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Director of SoC Implementation / Physical Design role at nxp full-time or part-time?
This is listed as a Full time position. It is posted as a Director of SoC Implementation / Physical Design role in the US63 NXP USA Inc. department at nxp.
Which team or department does the Director of SoC Implementation / Physical Design at nxp belong to?
This Director of SoC Implementation / Physical Design position is part of the US63 NXP USA Inc. department at nxp. See the full job description for more information about the team structure and responsibilities.
How do I apply for the Director of SoC Implementation / Physical Design position at nxp?
Click the "Apply Now" button on this page. You will be redirected to nxp's official application portal hosted on workday where you can submit your application directly.
When was the Director of SoC Implementation / Physical Design job at nxp posted?
This Director of SoC Implementation / Physical Design position at nxp was posted on Sep 25, 2026. Apply as soon as possible — early applications are often reviewed first.
Director of SoC Implementation / Physical Design
nxp
Apply for this role ↗

You'll be redirected to nxp's official application page on Workday.