College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding

amat· 0091 Applied Materials Singapore Technology Pte. Ltd.
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📍 Singapore,SGPFull time

About this role

Who We Are


Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. 


What We Offer


Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

The intern will support the development and validation of overlay metrology and defect inspection applications for a die-to-wafer hybrid bonding cluster system. The role involves engineering data analysis, image processing, and development of software utilities to improve measurement, inspection, and workflow efficiency. 

 

Key responsibilities include: 

Support metrology and defect inspection application development and testing. 

Analyze measurement and inspection data to evaluate system performance. 

Develop scripts and software tools for data processing, visualization, and automation. 

Apply image processing techniques for defect analysis and characterization. 

Prepare technical reports and collaborate with cross-functional engineering teams.

Additional Information

Time Type:

Full time

Employee Type:

Intern / Student

Travel:

No

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

Frequently Asked Questions

Is the salary disclosed for the College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding position at amat?
The salary for this College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding role at amat is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding position at amat located?
This College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding role at amat is based in Singapore,SGP. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding role at amat full-time or part-time?
This is listed as a Full time position. It is posted as a College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding role in the 0091 Applied Materials Singapore Technology Pte. Ltd. department at amat.
Which team or department does the College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding at amat belong to?
This College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding position is part of the 0091 Applied Materials Singapore Technology Pte. Ltd. department at amat. See the full job description for more information about the team structure and responsibilities.
How do I apply for the College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding position at amat?
Click the "Apply Now" button on this page. You will be redirected to amat's official application portal hosted on workday where you can submit your application directly.
When was the College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding job at amat posted?
This College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding position at amat was posted on Sep 4, 2026. Apply as soon as possible — early applications are often reviewed first.
College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding
amat
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You'll be redirected to amat's official application page on Workday.