Assembly Die Bond Process Engineer
nxp· MY62 NXP Malaysia Sdn Bhd
About this role
Job Summary
The Assembly Die Bond Engineer is responsible for developing, optimizing, and sustaining die bonding processes within semiconductor assembly manufacturing. The role focuses on achieving high product quality, yield improvement, process stability, cycle time reduction, and cost efficiency while supporting new product introductions (NPI) and continuous improvement initiatives.
Key Responsibilities
Process Development & Optimization
- Develop, qualify, and optimize die bonding processes for semiconductor packages.
- Establish process parameters and operating specifications.
- Perform process characterization and verification activities.
- Support new package development and technology transfers.
Production Support
- Provide daily engineering support to manufacturing operations.
- Troubleshoot die bondprocess-related issues.
- Analyze yield losses and process excursions.
- Implement corrective and preventive actions (CAPA).
Quality & Reliability
- Monitor process capability (Cp/Cpk) and manufacturing yields.
- Conduct root cause analysis using tools such as 8D, Fishbone, 5 Why, and FMEA.
- Ensure compliance with quality standards and customer requirements.
- Support reliability testing and qualification activities.
Continuous Improvement
- Drive cost reduction, productivity enhancement, and waste elimination projects.
- Utilize Lean Manufacturing and Six Sigma methodologies.
- Lead or participate in continuous improvement initiatives.
Documentation & Compliance
- Create and maintain process documentation, work instructions, and specifications.
- Prepare engineering reports, qualification reports, and technical presentations.
- Ensure compliance with safety, environmental, and company standards.
Qualification: Bachelor/Master in related engineering major with semiconductor experience in Die bond.
#LI-633aFrequently Asked Questions
Is the salary disclosed for the Assembly Die Bond Process Engineer position at nxp?
The salary for this Assembly Die Bond Process Engineer role at nxp is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the Assembly Die Bond Process Engineer position at nxp located?
This Assembly Die Bond Process Engineer role at nxp is based in Kuala Lumpur. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Assembly Die Bond Process Engineer role at nxp full-time or part-time?
This is listed as a Full time position. It is posted as a Assembly Die Bond Process Engineer role in the MY62 NXP Malaysia Sdn Bhd department at nxp.
Which team or department does the Assembly Die Bond Process Engineer at nxp belong to?
This Assembly Die Bond Process Engineer position is part of the MY62 NXP Malaysia Sdn Bhd department at nxp. See the full job description for more information about the team structure and responsibilities.
How do I apply for the Assembly Die Bond Process Engineer position at nxp?
Click the "Apply Now" button on this page. You will be redirected to nxp's official application portal hosted on workday where you can submit your application directly.
When was the Assembly Die Bond Process Engineer job at nxp posted?
This Assembly Die Bond Process Engineer position at nxp was posted on Sep 2, 2026. Apply as soon as possible — early applications are often reviewed first.
Assembly Die Bond Process Engineer
nxp
You'll be redirected to nxp's official application page on Workday.